A Transient Electrothermal Analysis of Three-Dimensional Integrated CircuitsT. Robert Harris, Shivam Priyadarshi, Samson Melamed, Carlos Otero, Rajit Manohar, Steven R. Dooley, Nikhil M. Kriplani, W. Rhett Davis, Paul D. Franzon, and Michael B. SteerA transient electrothermal simulation of a 3-D integrated circuit (3DIC) is reported that uses dynamic modeling of the thermal network and hierarchical electrothermal simulation. This is a practical alternative to full transistor electrothermal simulations that are computationally prohibitive. Simulations are compared to measurements for a token-generating asynchronous 3DIC clocking at a maximum frequency of 1 GHz. The electrical network is based on computationally efficient electrothermal macromodels of standard and custom cells. These are linked in a physically consistent manner with a detailed thermal network extracted from an OpenAccess layout file. Coupled with model-order reduction techniques, hierarchical dynamic electrothermal simulation of large 3DICs is shown to be tractable, yielding spatial and temporal selected transistor-level thermal profiles. |
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