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Filipp Akopyan, Carlos Tadeo Ortega Otero, David Fang, Sandra J. Jackson, Rajit Manohar
In recent years, there has been a trend among
digital and analog circuit designers towards three-dimensional
integration. There has been some debate regarding the applicability
of 3-D technology to general logic circuits, especially with
regard to thermal issues. We examine process variations on the
same layer, across layers, and cross-chip variations. We show
how the performance of each layer of the 3-D chip varies with
temperature, and demonstrate the effect of heat pipes on circuit
performance.
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