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From: Prakash (prakashkuve AT yahoo DOT com)
Date: Fri Nov 02 2001 - 01:01:16 EST

  • Next message: Erwin J. Prinz: "Mouse Issue in OpenGL Mode"

    Hi all,
             Here is an example of where having a DRC
    ignore <cellname> would be a great help. In SRAM
    layots, we might want to have a global cell which
    contains half the size of the via allowed in the
    process. The bitcell that contains this via cell would
    abut with a neighbouring bitcell and would get the
    other half from there. Hence it is no DEC violation
    but MAGIC would flag off an error inside the cell and
    this would be repeated in all the nummerous bitcells.
    There may be other such examples.
    
    Regards,
    Prakash.
    
    
    
    --- "Erwin Prinz (rzfm20)" <rzfm20 AT email DOT sps.mot.com>
    wrote:
    > All:
    > 
    > There was a question about what to do about
    > intentional design rule
    > violations. We don't let designs go to the mask shop
    > if they have any.
    > The issue is that for large system on a chip designs
    > it is easy to miss
    > other issues when introducing intentional
    > violations. So, for example
    > for a floating gate F/N oxide which requires an
    > extra mask to fabricate
    > anyway (to etch off the high voltage gate oxide
    > before growing the F/N
    > oxide) it is better to either add a plane to the
    > technology file for
    > "oxide" with types "low voltage oxide", "high
    > voltage oxide", and
    > "tunnel oxide") or to add a tile to form a special
    > channel with tunnel
    > oxide underneath. This would look as follows, where
    > I have elected to
    > define a plane rather than defining a new tile,
    > mainly because I use
    > "magic" to build device engineering test structures
    > where I need
    > complete control over the various masks used for
    > processing.
    > 
    > planes
    >  well,w
    > 
    > # this is the gate oxide plane - it can include low
    > voltage, high
    > voltage, medium voltage gate oxides, and ONO
    > interpoly dielectric
    >  gate, g
    >  implant,i
    >  active,a
    >  metal1,m1
    >  metal2,m2
    >  metal3,m3
    >  metal4,m4
    >  passivation,p
    >  contact
    >  via1
    >  via2
    >  via3
    > end
    > 
    > types
    >  ...
    >  /* oxide areas - used to distinguish active areas
    > */
    > 
    >  gate  tunnel_oxide
    >  gate  hvarea,hvgateoxide,hvoxide,hvgate,hvox,hvo,hv
    >  gate  ono,onoarea
    >  gate  dgo
    > ...
    > end
    > 
    > Of course, we then have complete design rules for
    > all devices including
    > the tunnel oxide device.
    > 
    > Best regards,
    > 
    > Erwin Prinz (ejprinz AT austin DOT rr.com)
    > > begin:vcard 
    > n:Prinz;Erwin J.
    > tel;pager:1-888-604-9978
    > tel;fax:512-895-2722
    > tel;home:512-288-4608
    > tel;work:512-895-8443
    > x-mozilla-html:TRUE
    > url:http://nvmtc.sps.mot.com/deviceweb/sonos
    > org:Motorola SPS Technology & Manufacturing;Embedded
    > Memory Center (eMC)
    > version:2.1
    > email;internet:Erwin.Prinz AT Motorola DOT com
    > title:Device Engineering Section Manager
    > adr;quoted-printable:;;MD: OE-341=0D=0A6501 William
    > Cannon Drive West;Austin;Texas;78735-8598;
    > x-mozilla-cpt:;20640
    > fn:Erwin Prinz, Ph.D.
    > end:vcard
    > 
    
    
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